The IEC is in the process of endorsing IPC-A as the globally preferred international acceptance standard for electronics assembly. AE training for through hole and surface mount solder joint acceptance standards inspection from IPC, a trade association for the electronics industry. IPC-AG is the latest revision of the most widely used electronics assembly standard in the world. IPC AG is now available from.

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The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A, have also been upgraded. Javascript is disabled on your browser. Training Media Permissible Uses. IPC-A is invaluable for all inspectors, operators and trainers.

IPC-A-610E IPC Certification

IPC-A iipc the most widely used electronics assembly standard in the world. Revision E has photos and illustrations of acceptability criteria of them new or updated.

Translations of the revised standard in multiple languages will be released in the coming months. IPC maintains additional offices in Taos, N.

For more information on IPCE, visit www. There are new sections on depanelization, board in board, package on package, and flex attachment, which Jack Crawford, IPC director of certification, calls “high interest topics. Please allow 2 business days for us to review and process your order. Sections have been reorganized so data and images are easier to find ip to make it easier to use.


IPC-AE Released: Industry Requirements for Acceptability of Electronic Assemblies Updated | IPC

In addition, the standard has been revamped for ease of use and clarity. IPC J-STDE provides material and process requirements for producing soldered electrical and electronic assemblies, aiding those who set up manufacturing processes. We will continue to accept orders via e-mail and web during our office closure.

Chinese – Download – Single-User License: Acceptability of Electronic Assemblies. IPC’s most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations. Topics include flex attachment, board in x, part on part, lead free, component orientation and soldering criteria for through-hole, SMT new termination styles and discrete wiring 610s, mechanical assembly, cleaning, marking, coating, and laminate requirements.

This revision has been critically reviewed for clarity and accuracy. See More See Less. The many changes that have occurred in array packaging since the standard’s last revision are also addressed in the E revision, as 610r changes to hot tear and fillet lifting. The E revision contains new or updated illustrations, bringing the total to more than Designers and manufacturers ilc appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular to the assembly using a through-the-board method.


Zenaida Valianu, training and development specialist at Celestica agrees, “The document is more intuitive and manageable than before, allowing users to navigate more easily and locate information promptly.

The document synchronizes to the requirements expressed in other industry consensus documents and ippc used with the material and process standard IPC J-STD To view this site, you must enable JavaScript or upgrade to a JavaScript-capable browser.

A must for all quality assurance and assembly departments, IPC-AE illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations.